The laboratory was initiated at the Department of Energy technology at Aalborg University in 2014 and within the 1st year power module prototypes based on 10 kV SiC components were realized.
Figure 1: Laboratory and power modules
The laboratory will be moved to custom built laboratory facilities in 2016.
Figure 2: 3D of the laboratory
In order to ensure a high quality in the prototype manufacturing the laboratory is equipped with a wide range of state of the art equipment as listed below:
Figure 3: F&S Bondtec: Wirebonder - Pull & Shear test
- Al wedge wirebonding for power interconnects.
- Modular wirebond head replaceable with pulltest or sheartest head.
- Al heavy wires with Ø250-500 micron.
Figure 4: Schunk sonosystems DS20 ultrasonic welder
Figure 5: Asscon VP800 Vacuum Vapour Phase
Vapour phase reflow soldering system. Combined with the built-in vacuum module the soldering system provides voidfree and reliable soldering of dies and DBC- baseplate stacks.
Figure 6: KSI V8 Scanning Acoustic Microscope
Scanning acoustic microscope fitted with a 20 MHz transducer that enables nondestructive evaluation of entire modules to check for soldering quality and wirebonding.
Figure 7: PlasmaEtch PE-75 venus RF plasmacleaning system
Cleaning and surface modification of parts as well as hybrid circuits using 13.56 MHz RF argon and oxygen plasma processes.
Figure 8: Chemical Wet stations (left) & Fortuna Class 100 clean workstation (right)
Chemical Wet stations (left) for surface preparation, deposition and cleaning. Yellow light conditions on demand for photosensitive processes such as photoresist spincoating, development etc.
Fortuna Class 100 clean workstation (right) A dustfree laminar flow workstation for dust sensitive process steps such as solder application and die placement.
Figure 9: Vacuum chamber facilities
Degassing of encapsulant gels or epoxies before and after potting of final modules to eliminate bubbles in encapsulants.
Figure 10: Material sample preparation for microscopy
Diamond cutting and polishing to make sections of modules and power components such as Si IGBTS, SiC MOSFETS, GaN HEMT etc.